This equipment features a multi-zone closed-loop constant-temperature hot air circulation system, delivering a gradual, precisely controlled heating profile tailored to the thin, lightweight, and deformation-prone nature of flexible circuits. It efficiently accomplishes solder paste reflow soldering on FPC surfaces, effectively eliminating defects such as cold solder joints, insufficient wetting, and solder bridging. The system ensures robust, reliable solder connections on flexible boards with excellent durability under repeated bending. It serves as a core, high-precision soldering platform within the FPC SMT assembly process.