This equipment features a uniform, fully regulated constant-temperature control system, precisely tailored to the distinct thermal requirements of rigid FR-4 PCBs and flexible FPC circuits. It is utilized for substrate dehumidification and moisture removal, resin curing and solidification, interlayer stress relief, and high/low-temperature reliability aging tests. By effectively mitigating issues such as warpage and delamination in rigid PCBs, as well as curling and distortion in FPC flexible circuits, it consistently enhances dimensional accuracy, interlayer bonding strength, and long-term operational reliability for both product categories. This oven is an indispensable core process tool for the volume production of both PCB and FPC circuit boards.