This equipment utilizes a high-pressure spray chemical delivery system coupled with a precision conveyor mechanism to perform efficient developing and cleaning of substrate surfaces. It precisely executes pattern development of exposed dry film or wet film, removal of uncured resist layers, and subsequent board surface rinsing and drying. For rigid PCBs, it achieves residue-free cleaning with uniform flatness; for flexible FPCs, it employs a gentle, low-tension conveyance process to prevent material stretching or damage. By effectively ensuring circuit pattern definition and surface cleanliness, this system serves as a critical post-processing apparatus prior to etching for both categories of circuit boards.