This equipment is a constant-temperature dry film laminator specifically designed for FPC flexible circuits. Employing a gentle, constant-temperature roller pressing process, it applies photosensitive dry film smoothly and bubble-free onto the copper foil surface of FPC substrates. Precisely adapted to the ultra-thin, highly flexible nature of flexible circuits, the machine reliably ensures the accuracy of fine-line exposure and subsequent etching pattern formation. It effectively enhances FPC circuit integrity and interlayer lamination reliability, serving as a critical piece of equipment in the precision manufacturing of flexible printed circuits.